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Using Nanotechnology to Boost Boiling Efficiency
Summary posted by Meridian on 6/29/2008 Researchers from Rensselaer Polytechnic Institute (RPI) in the U.S. have found that by lining the bottom of a metal vessel with a layer of copper nanoparticles called nanorods, they can reduce the energy required to boil water by an order of magnitude, a finding that could potentially have implications for cooling computer chips, improving heat transfer systems, and reducing costs for industrial boiling applications. Researcher Nikhil A. Koratkar said: "The increased boiling efficiency seems to be the result of an interesting interplay between the nanoscale and microscale surfaces of the treated metal. The potential applications for this discovery are vast and exciting, and we're eager to continue our investigations into this phenomenon. . . We observed a 30-fold increase in active bubble nucleation site density — a fancy term for the number of bubbles created — on the surface treated with copper nanotubes, over the nontreated surface." According to the article, improvements in the efficiency of boiling can lead to significant efficiency improvements and cost savings in a variety of industrial applications that use boiling to create heat or steam. The article says that the finding could also be used to improve the process of cooling computer chips, enabling the development of smaller, more powerful chips. Koratkar said, “Since computer interconnects are already made of copper, it should be easy and inexpensive to treat those components with a layer of copper nanorods.” The article can be viewed online at the link below. The original article may still be available at www.azonano.com/news.asp?NewsID=6695 As tagged by Meridian Institute:
Energy:
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Nanomagnets Remove Pathogens from Blood
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